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PDF ( 数据手册 , 数据表 ) SPZT2222AT1G

零件编号 SPZT2222AT1G
描述 NPN Silicon Planar Epitaxial Transistor
制造商 ON Semiconductor
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SPZT2222AT1G 数据手册, 描述, 功能
PZT2222A, SPZT2222A
NPN Silicon Planar
Epitaxial Transistor
This NPN Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT223
package which is designed for medium power surface mount
applications.
Features
PNP Complement is PZT2907AT1
The SOT223 Package Can be Soldered Using Wave or Reflow
SOT223 Package Ensures Level Mounting, Resulting in Improved
Thermal Conduction, and Allows Visual Inspection of Soldered
Joints
The Formed Leads Absorb Thermal Stress During Soldering,
Eliminating the Possibility of Damage to the Die
Available in 12 mm Tape and Reel
AECQ101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
CollectorEmitter Voltage
CollectorBase Voltage
EmitterBase Voltage
(Open Collector)
VCEO 40 Vdc
VCBO 75 Vdc
VEBO 6.0 Vdc
Collector Current
IC 600 mAdc
Total Power Dissipation
up to TA = 25°C (Note 1)
PD W
1.5
Storage Temperature Range°
Tstg 65 to +150 °C
Junction Temperature°
TJ 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x
0.059 inches; mounting pad for the collector lead min. 0.93 inches2.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Resistance,
JunctiontoAmbient
RqJA
Lead Temperature for Soldering,
0.0625from case
Time in Solder Bath
TL
Value
83.3
260
10
Unit
°C/W
°C
Sec
http://onsemi.com
SOT223 PACKAGE
NPN SILICON TRANSISTOR
SURFACE MOUNT
SOT223 (TO261)
CASE 318E04
STYLE 1
COLLECTOR
2, 4
BASE
1
3
EMITTER
MARKING DIAGRAM
AYM
P1FG
G
A = Assembly Location
Y = Year
M = Month Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
PZT2222AT1G
SPZT2222AT1G
PZT2222AT3G
SOT223
(PbFree)
SOT223
(PbFree)
SOT223
(PbFree)
1,000 Tape & Reel
1,000 Tape & Reel
4,000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
January, 2013 Rev. 8
1
Publication Order Number:
PZT2222AT1/D












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